You will be required to work closely with product engineering, probe engineering, process engineering and QA to fully characterize high density flash arrays and test structures for performance, yield and reliability. You will also routinely work directly with engineers in QA, Test, Product, and Process Integration, starting with reliability issues ultimately leading to new process qualifications and improved reliability. Your work will involve the use of JMP, and other software that enables statistical analysis of large parametric and reliability data sets.